Glass Frit for Laser-sealing
Achieving high-precision sealing
Glass Frit for Laser-sealing enables hermetic sealing of glass substrates and dissimilar materials such as alumina, LTCC, and silicon, as well as sealing glass substrates to each other. It is ideal for devices that require high reliability, as it prevents thermal damage to the device during sealing.
Features
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Prevents thermal damage to internal components through localized heat sealing
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Ensures high reliability of hermeticity
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Fritted glass substrates available upon request
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Support provided for creating prototype conditions for laser sealing
Laser-sealing Process
Applications
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MEMS package
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Deep UV LED package
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Hermetic sealing package
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OLED display
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Perovskite solar cell
Compatible Cavity Materials and Sizes
| Cavity materials | Package/Substrate size | Glass lid thickness |
|---|---|---|
| LTCC | ～60mm | ～1mm |
| Alumina | ～60mm | ～0.5mm |
| Glass | ～200mm | ～1mm |
| Silicon | ～10mm | ～0.2mm |
Supply Form and Process
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Prototype supply is available in the following forms.
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Process simplification on the user's side is possible.
1. Provide a prototype package laser sealed by NEG
2. Supply glass lids coated with laser glass frit and sintered (laser sealing is performed by the user)
Glass lids with sintered laser glass frit are available in a range of options to match various coefficients of thermal expansion.
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関連製品
Low Temperature Sealing Glass
Granulated Glass for Metal Packages
Passivation Glass
Composite Powder for Low Temperature Cofired Ceramics
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