Glass Wafer for Supporting Semiconductors

High-precision glass substrates available in a wide range, from low to high expansion

These high-precision carrier substrates support chips and other components in the semiconductor packaging process. We offer a wide range of glass, from low to high expansion, and can provide glass tailored to the requested coefficient of thermal expansion.

Features

  • Wide range of products from low to high expansion
  • TTV*1 <1 μm is possible (φ12 inch).
  • T7 code compatible
  • Total Thickness Variation

Properties

Glass cord ABC-G A58 A66S A69 A75 A91S
Coefficient of thermal expansion 20～220℃ ppm/℃ 3.6 5.6 6.3 6.6 7.2 8.7
20～260℃ ppm/℃ 3.7 5.7 6.4 6.7 7.3 8.8
Young’s modulus GPa 73 70 77 74 75 70
Dielectric constant 1MHz, 25℃ 5.3 6.2 6.5 6.8 6.9 7.7
tan δ 1MHz, 25℃ 0.001 0.02 0.01 0.01 0.01 <0.03
Volume Resistivity Logρ 150℃ Ω・cm ー 8.1 8.6 8.3 8 7.1
250℃ Ω・cm ー ー 6.8 ー 6.2 ー

Glass with different coefficients of thermal expansion is also available upon request.

Applications

  • Support substrate for advanced package
  • Support substrate for compound semiconductor
  • Support substrate for precision polishing

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関連製品

Zero CTE Glass: ZERO™

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