Semiconductor

Glass Wafer for Supporting Semiconductors

These high-precision carrier substrates support chips and other components in the semiconductor packaging process. We offer a wide range of glass, from low to high expansion, and can provide glass tailored to the requested coefficient of thermal expansion.

Glass Wafer for CSP

Low expansion, alkali-free, and polishing-free glass wafers are used for the cover glass of Wafer Level Chip Size Package (WLCSP) CMOS image sensors.

半導体パッケージ用無機コア基板

次世代半導体パッケージに使用される無機コア基板です。ガラスセラミックとガラス基板があり、半導体パッケージ設計に貢献します。

Composite Powder for Low Temperature Cofired Ceramics

Composite Powder for Low Temperature Cofired Ceramics (LTCC) can be fired at 870 to 900°C. This allows the use of gold or silver paste, which offer high electrical conductivity, for the inner layer conductor—resulting in circuit substrates with excellent electrical properties.